Canteliver Probe Card
MPI Cantilever Probe Card is greatly used on gold bump and pad wafer testing for Show driver, logic, and memory gadget. MPI’s cantilever probes are definitely the corresponding respond to to the calls for of fine pitch, small pad measurement, substantial velocity, considerably less cleaning, multi-DUT, superior pin depend, and ultra-lower leakage needs. With remarkable craftsmanship, progressive architecture and tested methodologies according to mechanical and electrical simulation/measurement benefits, building MPI the best cantilever service provider throughout the world.
FCB Probe Card
The FCB Probe Card is considered the most experienced technological innovation of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-industry (TTM) and cost of test (COT) demand. FCB is actually a established Alternative for several different semiconductor generation tests from early engineering pilot-runs to large volume producing (HVM). FCB is ready for device demanding high signal integrity probing (SI) and/or electrical power integrity probing (PI). Apps include chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus much more. FCB guarantees the globe’s greatest overall Price-of-ownership (COO) for many DUT applications.
EVS Probe Card
The EVS Probe Card is definitely an improvement above the standard buckling beam probe card. Key features are increased latest carrying capability (C.C.C.) and lessen balanced Speak to force (BCF), and also overall MEMS-like attributes. EVS can easily satisfy the need of Superior wafer probing. Exact alignment and superb planarity Management are classified as the key aspects contributing to stable Make contact with resistance. With its ability and performance, EVS Probe Card is a great option for State-of-the-art probe cards.
Osprey probe card
The Osprey probe card is MPI’s Resolution to desire for at any time finer pitch. It's made for smaller sized Al pad, and is ideal for tiny pitch application with peripheral and complete array pattern. With precise alignment and much better planarity control, Osprey can reach higher efficiency by multi-DUT style and design. The forming wire (FW) sort needle developed with MPI’s have micro fabrication process not only delivers superior-good quality functionality but in addition permits uncomplicated needle substitute and shortens sustaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is provided with MEMS wire (MW) needle that's designed for the demand from customers of small pressure probing. In addition, it comes with the ability to satisfy higher C.C.C. and superior pin counts application. The MEMS process makes certain very dependable needle features, as well as the special framework design allows exact alignment and planarity Manage.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and website for many generations to come.
https://www.mpi-corporation.com/probecard/